Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...
Dublin, July 09, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Lead Frame Market - Forecasts from 2025 to 2030" report has been added to ResearchAndMarkets.com's offering. The semiconductor lead frame ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...
Custom-designed, photochemically etched surface-mount and insert-mount lead frames for integrated circuit manufacturing are now available. The frame’s base materials include Kovar, nickel-iron alloys, ...
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