Semiconductor Engineering

Insights Into Advanced DRAM Capacitor Patterning: Process Window Evaluation Using Virtual Fabrication

With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...
TechSpot

Micron's 1-alpha process node offers impressive improvements in DRAM density and performance

Forward-looking: Memory technology has continuously improved over the last decade to meet the increasing demand for higher bit density, performance, and energy efficiency. Micron is touting new ...
EDN

DRAM MIMCAP process is next focus for IMEC 32-nm project

LONDON — Belgian research organization IMEC has extended its work on 32-nm CMOS device scaling to include a project on DRAM MIMCAP (metal-insulator-metal capacitors) process technology. The group says ...
TweakTown

Samsung's 1c DRAM yields leap: 0% to 40% giving the greenlight for HBM4 mass production

TL;DR: Samsung's 1c DRAM yield for next-gen HBM4 memory has improved from 0% to around 40%, enabling planned mass production later this year. Design restructuring and process optimizations enhanced ...
EDN

DRAM basics and its quest for thermal stability by optimizing peripheral transistors

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The ...