ONYX 3200 metrology equipment enables the complete metal inspection for all processes -- from chip wiring to advanced ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and is projected to grow to USD 114.28 billion in 2034, according to research conducted by ...

Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for radio frequency, microwave, and millimeter-wave ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will ...

Chips are getting bigger in a bid to offer more functionality, and conversely, packages are required to house these bigger die sizes in even more compact form factors. That inevitably mandates new ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power discretes, ICs, modules, and ...

Tortola, British Virgin Islands, Jan. 10, 2024 (GLOBE NEWSWIRE) -- SEALSQ Corp (LAES), a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

(TNS) — President Joe Biden virtually celebrated with Michigan leaders as $52 billion in semiconductor incentives move closer to becoming a reality. The CHIPS and Science Act is currently awaiting ...