The market growth is driven by increasing semiconductor testing volumes, advanced node scaling, rising adoption of high-frequency and fine-pitch probes, and expanding OSAT and wafer-level testing ...

Tokyo — NEC Corp. has developed an optical-fiber probe small enough to insert between the balls of a BGA package, where it can “see” the electric field around the pins. By next March, NEC engineers ...

The world's first rhodium material to simultaneously offer high strength, elasticity hardness, and electrical conductivity TOKYO, Nov 12, 2025 - (JCN Newswire) - TANAKA PRECIOUS METAL TECHNOLOGIES Co.

Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to ...