SAN DIEGO--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...
One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...
SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...
SCOTTSDALE, USA: Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. Put another way, package selection is increasingly important to ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Intelligent power module (IPM) in a high efficiency, ultra-compact, highly integrated QFN package saves energy when driving motors up to 200W. With over 200 million motors produced every year with ...
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