NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power ...

New-generation Airfast RF Multi-Chip Modules (MCMs) extend frequency coverage to 4.0 GHz, leveraging the performance of NXP’s latest LDMOS technology and integration design techniques Higher output ...

NXP Semiconductors is making available its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements ...

Yet another mainstay of classic analog engineering, the magnetron, is being targeted for silicon replacement. In the last year or so, RF semiconductors aimed at heating applications have started to ...

NXP and Murata have combined to deliver RF front-end modules to Wi-Fi 6 standards. The NXP FEIC comes in a chip scale package (CSP) suitable for module integration and can support various 5G ...

EINDHOVEN, The Netherlands, April 23, 2020 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced it has collaborated with Murata, a system-in-package integrator for 5G mobile ...

Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...

NEC’s Massive MIMO 5G antenna RU features a 5G open virtual radio access network (vRAN) interface and has been adopted by Rakuten Mobile for its fully virtualized cloud-native mobile network. The RU ...

TOKYO and EINDHOVEN, The Netherlands, Oct. 12, 2020 (GLOBE NEWSWIRE) -- NXP® Semiconductors N.V. (NXP; NASDAQ: NXPI) and NEC Corporation (NEC; TSE: 6701) today announced that NEC selected NXP to ...

TOKYO, Japan and EINDHOVEN, The Netherlands, October 13, 2020 – NXP® Semiconductors N.V. (NXP; NASDAQ: NXPI) and NEC Corporation (NEC; TSE: 6701) today announced that NEC selected NXP to supply RF ...