Guidelines for PCB design, rework, and package performance information such as Moisture Sensitivity Level (MSL) rating, board level reliability, mechanical and thermal resistance data …

The Quad Flat Package (QFP) is a surface-mount integrated circuit package. The QFP package has a standard form with a leaded plastic package with a flat rectangular body and square. …

The QFP footprint shown in Figure 3-1 is a design that shows a 0.4mm pitch 64 pin package within a 0.5mm pitch 64 pin QFP. Using the following recommended pad guidelines allows for …

SFA SEMICON’s Quad Flat Pack (QFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The QFP is targeted at cost sensitive applications while …

Besides their electrical function, the exposed pad areas of QFP packages are designed to conduct high thermal loads into the PCB in order to achieve an optimal thermal performance.

Package outline note QFP64 (SOT1697-1) Limited warranty and liability — Information in this document is believed to be accurate and reliable.

Series IC200 / IC201 / IC216 / IC217 / IC218 / IC248 (Open Top) Quad Flat Packages (QFP)